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Partial Au plating / Ni barrier [for electronic components, etc.!]

[Patent Pending!] Achieves conventional plating solution without stripping process, contributing to cost reduction!

Our uniquely developed special partial plating mask method allows for mass production using "standard plating solution" and "without a stripping process." By combining two independently developed mechanisms, the area of partial Au plating has become clear. This clarification of the area has also led to cost reduction. 【Features】 ■ Achieves cost reduction ■ Elimination of offline laser stripping processes ■ High area precision with dimensional tolerance of ±0.125mm or less *For more details, please contact us or download the catalog.

• Company：上田鍍金
• Price：Other

• Plating Equipment